Onto Innovation Competitive Intelligence & Landscape

ASML Holding N.V. (ASML) is another major competitor, particularly in the photolithography systems market [source].

ASML is known for its advanced lithography systems, which are critical for semiconductor manufacturing. While Onto Innovation offers lithography solutions for advanced packaging, ASML is a dominant force in high-volume, leading-edge lithography, often with a significantly larger market capitalization and enterprise value [source].

KLA Corporation (KLA) stands out as a direct competitor, especially in process control and inspection solutions [source].

KLA is a recognized leader in process control, offering equipment and services for wafer inspection, metrology, and defect review. Both Onto Innovation and KLA provide critical solutions for ensuring quality and yield in semiconductor manufacturing, with KLA often described as an "undisputed" leader in process control [source] [source].

Lam Research Corporation (LRCX) is also a prominent competitor in the semiconductor equipment industry, specializing in wafer fabrication equipment and services [source]. While Onto Innovation offers a suite of products across inspection, metrology, lithography, and software, Lam Research is particularly strong in areas like etch, deposition, and cleaning processes that are fundamental to chip manufacturing. Their extensive product lines and global reach position them as a strong contender against Onto Innovation's specialized offerings [source].

Indirectly, companies like Camtek (CAMT) and Nova Ltd. (NVMI) compete with Onto Innovation in specific segments such as inspection and metrology.

Camtek is known for its inspection and metrology equipment for advanced packaging, while Nova Ltd. focuses on process control and metrology for semiconductor manufacturing. These companies offer specialized solutions that can overlap with aspects of Onto Innovation's product portfolio, providing alternatives for customers seeking specific functionalities in their semiconductor production workflows [source] [source].

Recent strategic appointments have further strengthened the company's C-suite.

Ido Dolev was appointed Executive Vice President, Product Solutions at the end of 2024, tasked with unifying all product solutions [https://ontoinnovation.com/wp-content/uploads/2025/08/onto-innovation-annual-report-24-ir-web-pdf.pdf]. In another significant hire, Shirley Chen joined as Senior Vice President of Customer Success, leading global sales, applications, and service organizations [https://investors.ontoinnovation.com/news/news-details/2025/Onto-Innovation-Enhances-Leadership-Team-with-Two-Senior-Executive-Appointments/default.aspx].

Yoon Ah E. Oh serves as Senior Vice President and General Counsel, bringing extensive legal experience from previous roles in the semiconductor and pharmaceutical industries [https://investors.ontoinnovation.com/governance/board-of-directors/person-details/default.aspx?ItemId=d9f94b27-add6-4c59-9a02-28dab2a38c83].

The Onto Innovation Board of Directors plays a crucial oversight role [https://investors.ontoinnovation.com/governance/board-of-directors/default.aspx].

Christopher A. Seams holds the position of Chairman of the Board [https://ontoinnovation.com/writable/files/onto-innovation-annual-report-23-notices.pdf]. The board includes members such as Stephen D. Kelley, Susan D. Lynch, David B. Miller, Michael P. Plisinski, Stephen S. Schwartz, Christopher A. Seams, and May Su [https://investors.ontoinnovation.com/governance/committee-composition/default.aspx].

May Su joined the board in 2022, contributing over 35 years of leadership in the semiconductor capital equipment industry, with a strong background in strategy and strategic marketing [https://investors.ontoinnovation.com/governance/board-of-directors/person-details/default.aspx?ItemId=ae74fc46-d8de-444b-86de-60077d2bb03e]. These individuals are integral to the company's governance and strategic direction [https://investors.ontoinnovation.com/governance/board-of-directors/default.aspx].

Onto Innovation supports a broad base of over 240 customers, including prominent industry leaders. The company has a long-standing and significant relationship with TSMC, having received multiple honors from them, including the "Novel Technology Collaboration Award" in 2023 for early collaboration on optical metrology and inspection technologies, and recognition for "Excellent Production Support" in 2025 for leveraging artificial intelligence in process control. Additionally, Onto Innovation secured a substantial $69 million volume purchase agreement from a leading DRAM manufacturer for its optical metrology ecosystem, which includes common films, optical critical dimension, and integrated metrology, with deliveries commencing in 2025. Another significant client, a 3D NAND manufacturer, placed $85 million in orders for Onto Innovation's integrated OCD and thin film metrology suite, with products achieving "tool of record" status, including the Atlas® V system for complex 3D structures and the new Iris™ planar thin film system.

The company's Packaging Applications Center of Excellence (PACE), located at its Wilmington, Massachusetts headquarters, serves as a collaborative hub. This facility combines Onto Innovation's advanced panel-level photolithography, inspection, and metrology tools with a network of collaboration partners. These partners represent key process steps across the supply chain, including panel package and IC substrate manufacturers, as well as process and design technology providers, all working together to accelerate advanced packaging R&D, particularly for innovations enabling 2.5D, FOPLP, 3D chiplet architectures, and AI packages.

Furthermore, Onto Innovation has seen repeat orders of its Atlas® V optical critical dimension (OCD) platform from a third customer for gate-all-around (GAA) / nanosheet transistor development and pilot production, underscoring its role as a trusted strategic partner in the development of next-generation device architectures for advanced logic. The company has also secured over $100 million in orders for inspection systems supporting advanced packaging for AI, indicating strong demand from customers focused on heterogeneous integration.